VAX 9000 packaging-the multi chip unit
D.E. Marshall, J.B. McElroy · 2002
The VAX 9000 achieves its high performance through the use of high-speed hardware and architectural features that reduce both cycle time and cycles per instruction execution. The multi chip unit (MCU), the heart of the high-density packaging approach which makes the fast cycle time possible, is described. The performance analysis that led to the selection of this packaging technology is reviewed. This is followed by a brief description of the semiconductors and an overview of the MCU, its components, and their performance. The VAX 9000 logic is based on the Motorola MCAIII emitter-coupled-logic gate array technology. Housing and connector features are briefly examined.>