Research progress and development trend of epoxy resin adhesives with room temperature curing and heat resistance
Meiling Li · China Adhesives · 2009
The research progress and development trend of epoxy resin(EP) adhesives with room temperature curing and heat resistance were summarized.Some EP adhesives with excellent performances were introduced at home and abroad.It is indicated that the development trend for EP adhesive with room temperature curing and heat resistance is high temperature resistance,high strength,high endured and fast curing.