Fast Thermal Simulation using SystemC-AMS
Yukai Chen, Sara Vinco, Enrico Macii, Massimo Poncino · 2016
Out of the many options available for thermal simulation of digital electronic systems, those based on solving an RC equivalent circuit of the thermal network are the most popular choice in the EDA community, as they provide a reasonable tradeoff between accuracy and complexity. HotSpot, in particular, has become the de-facto standard in these communities, although other simulators are also popular. These tools have many benefits, but they are relatively inefficient when performing thermal analysis for long simulation times, due to the occurrence of a large number of redundant computations intrinsic in the underlying models.