Technology of Many Gold Studs for Flip-Chip
Guo Da-qi · Electronics & Packaging · 2007
A new way of design and fabrication method of IC pad for flip-chip use introduced in this article. By careful design the IC pad, more than one gold stud are bumped on those new pads, and interconnections with high reliability are obtained consequently. This method can also be used for the fabrication of KGD.