Optimization and Improvement in Open/short Test in High Volume Manufacture
Gu Chen · Electronics & Packaging · 2010
Current DC open short test meets the bottleneck in both test time and test efficiency and its test time is nearly 1 second which causes long test time of the whole flow leading to negative impact on the manufacture delivery.In this paper,we will introduce the dynamic open short test and VTT Terminal open short test which are improved on both test methodology and test flow,and it will solve the bottleneck we mentioned above.Based on the test data comparison on the same unit,we find that these test methodology will obviously improve the efficiency and lower the cost to the semiconductor high volume manufacture.The reduction time will arrive 40 minutes if we run the whole lot.Besides that,this dynamic methodology can also be used on other static DC test items and it will lead to more improvement on the test time and test efficiency.