Survey on Topologies of Three-Dimensional Network on Chip
Zhang Da-ku · Jisuanji kexue yu tansuo · 2015
Three-dimensional network on chip(3D No C) is developed based on three-dimensional integrated circuit(3D IC), system on chip(So C) and two-dimensional network on chip(2D No C). 3D No C is mainly used to solve the problems such as communication bottleneck of highly integrated chips. It has attracted great attention from both academia and industry at home and abroad. 3D No C topology structure reflects the layout and connectivity of communications node in the chip, which is crucial for the performance of 3D chip. This paper introduces 2D No C, the evolution from 2D No C to 3D No C, the advantages and problems of adopting 3D No C and the key technical issues which can be solved by 3D No C, and analyzes the overall development of 3D No C. 3D topology is one of the key problems in the design of 3D No C. This paper mainly studies the different classification methods for 3D No C topology and divides 3D No C topologies into 9 categories in terms of communication, then gives a thorough study of 3D No C topology structures with comparison and analysis of the characteristics for each topology structure. Finally, this paper indicates the possible future research development of 3D No C topology.