Build-in Testability Design in DC-DC Converters for Wafer and Package Test
Hongyi Wang · Research & Progress of SSE Solid State Electronics · 2008
Build-in testability design in monolithic DC-DC converters is presented. The chip enters into a special test mode by controlling the external pins. With multiple uses of the pins,measurements of many electrical characteristics such as reference voltage,oscillator frequency and on resistance are realized. The proposed method does not need to cooperate with complicated external control structures and suits for wafer and package test,which reduces the complexity in programming and improves test efficiency. It has been used in a high efficiency synchronous DC-DC buck converter with current mode control in TSOT package. The measurement results show that the build-in testability design has no effect on normal operation and achieves good accuracy satisfying demands.