The design of fire-fighting system for gold wire bonder
Dawei Wu · Informationization · 2009
Semiconductor packaging equipment gold wire bonde's the fire-fighting system was designed, C8051F000 MCU is direct chip. The PID and to PWM technology were used to design a high-performance digital switching power supply. Then the devices-FBT was controlled effectively. This system is characterized by: the voltage steady, a good controllable system , high-quality, low-cost system, and so on.