Based on Longson3A Processor Package Heat Dissipation Design
Jian Wang · Computer Engineering and Science · 2009
With the microprocessor performance becomes more and more high,the processor package become a critical issue in processor applications.A high-quality package can not only protect processor IC from electrostatic interference,moisture environment,but also transform the heat to outside air generated by processor.This paper proposes a package solution to Loongson3A processor.It analyzes the requirement of Loongson3A and chooses FC-BGA1121 package for Loongson3A to solve the heat dissipation issue.