Effect of Ground Heating on the Mechanical Properties of Particleboard Floor
Zhongfeng Zhang · Anhui nongye kexue · 2009
[Objective] The aim was to explore the change law of mechanical properties of particleboard floor.[Method] The ground heating conditions were simulated and with heat treatment time and temperature as experimental factors,all factor test was used for heat treatment on 12 mm particleboard and the effect of ground heating on mechanical properties of particleboard floor was studied.[Result] The effects of temperature on internal bond strength,static bending strength and elastic modulus of particleboard were more obvious.With increment of temperature,the internal bond strength of particleboard was first increased and then decreased,the change on static bending strength was less and elastic modulus showed downtrend.While during the process of heat treatment,the effects of time on static bending strength,elastic modulus and internal bond strength of particleboard were relative poorer.With prolonging of time,the static bending strength and elastic modulus of particleboard only produced less fluctuation,but the internal bond strength showed larger fluctuation.The mechanical properties of particleboard could be improved by thermal aging treatment.[Conclusion] The research provided the reference for particleboard production.