VDSM interconnect characteristics and the place and route optimization

Huijun Li · Micronanoelectronic Technology · 2004

As the ICs are scaled into very deep submicrometer dimensions,interconn ects becomes critical in determining overall system performence and reliability. This paper presents some optimization steps in place and route flow,includin g congestion-driven placement,area placement and search refine,track assignme nt and search repair. The optimization steps integrated with the VDSM place an d route systems Apollo-Ⅱ can efficiently solve the interconnects challenges su ch as crosstalk noise and violations.

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