TDMA Based High-Speed Slave Interconnect for Multi-Layer AHB
Shengli Lu · Dianzi qijian · 2008
The performance and functionality breakthroughs of SoC bring new challenges,such as efficiently interconnecting a large number of IP blocks,Bottleneck still exists when the same intellectual property block is accessed simultaneously,whereas there have been considerable attempts to implement multi-channel fabrics basing on shared bus for maximum reusability.A time-division-based interconnect is proposed for the intellectual property blocks causing resource contentions frequently,which rearranges the accessing information and allocates the resources in a time-division manner.It is showed to introduce no latency to parallel transmitting accesses,and is completely transparent to the IPs.Finally,it is implemented on the basis of dual-layer AHB.