Fault-Tolerant 3-D Network-on-Chip Design using Dynamic Link Sharing
Seyyed Hossein Seyyedaghaei Rezaei, Mehdi Modarressi, Reza Yazdani Aminabadi, Masoud Daneshtalab · 2016
The most important challenge in the emerging 3D integration technology is the higher temperature, particularly in the layers that are more distant from the heat sink, compared to planar 2D chips. High temperature, in turn, increases circuit's susceptibility to permanent and intermittent faults. On the other hand, the fast and high-bandwidth vertical links in the 3D integration technology have opened new horizons for network-on-chip (NoC) design innovations. In this paper, we leverage these ultra-low-latency vertical links to design a fault-tolerant 3D NoC architecture. In this architecture, permanent and intermittent defects on links and crossbars are bypassed by borrowing the idle bandwidth from vertically adjacent links and crossbars. Evaluation results under synthetic and realistic workloads show that the proposed fault-tolerance mechanism offers higher reliability and lower performance loss, when compared with state-of-the-art fault-tolerant 3D NoC designs.