WLAN/Bluetooth
George Chien, Mototsugu Hamada · 2007
The proliferation of wireless communication devices in recent years has driven their adoption into consumer electronics. The wide range of applications in the consumer markets demands lowest power (handheld devices), highest data rate (video distribution), highest level of integration (small form factor), and lowest cost (low component count). These requirements have been applied to the popular WLAN and Bluetooth devices in the previous years. In this session, a collection of current state-of-the-art devices that attempt to address each one of these requirements will be presented. These include an enhanced-data-rate (EDR) Bluetooth SoC that achieves Receiver/Transmitter (RX/TX) power of 38/48mW for low power, a multi-band MIMO transceiver IC that achieves >270Mb/s PHY rate for high throughput, an 802.11a/b/g SoC in 0.13 μm CMOS, and an 802.11g SoC with integrated power amplifier implemented in 0.18μm CMOS for low cost.