A New Package Structure for High Speed eStorages
Hye-Jin Kim, Sunghoon Chun, Jaeyeon Hwang, Ilmok Kang · IMAPSource Proceedings · 2014
Mobile storage density per chip (NAND, DRAM, etc) has increased as well with ever growing usage of high speed mobile systems. For these requirements, various eStoarge solutions (eMMC, eMCP, etc) have been developed. To optimize high speed and high density requirements in a tighter limited packaging space, we propose a new package structure using RDL(Re-Distribution Layer) on chips for optimal design with a high interface speed, smaller and cheaper package in this paper.