Circular pattern extraction in wafer fault mining
Jie Ma, Quanming Zhao · 2008
A method on circular pattern measurement in wafer fault pattern retrieval system is developed. It can help engineers to query circular wafer fault pattern to historical or other patterns for manufacturing fault detection and tracking. An enclosing polygon based on the vertices of boundary edges is constructed to describe the border of circular pattern. Experimental results show that the proposed approach improves the accuracy and effectiveness of circularity measurement.