Modelling modern processors using FEM and compact model — A comparative study
Melvin Galicia, Piotr Zając, Cezary Maj, Michał Szermer, Andrzej Napieralski · 2014
A variety of thermal models has been proposed to predict the temperatures inside modern processors. In this paper, we describe and compare two such approaches, a detailed FEM-based simulation and a simpler architectural compact model. It is shown that both models provide comparable results when it comes to predicting the maximal temperature, however there are also non-negligible differences when estimating thermal gradients within a chip.