System-in-package testing: problems and solutions
Davide Appello, Paolo Bernardi, Michelangelo Grosso, Matteo Sonza Reorda · IEEE Design & Test of Computers · 2006
System-in-package integrates multiple dies in a common package. Therefore, testing SiP technology is different from system-on-chip, which integrates multiple vendor parts. This article provides test strategies for known good die and known good substrate in the SiP. Case studies prove feasibility using the IEEE 1500 test structure