Post-route optimization for improved yield using a rubber-band wiring model
Jeffrey Z. Su, Wayne Dai · 1997
This paper presents a unique approach to improve yield given a routed layout. Currently after routing has been completed and compacted, it generally proceeds to verification without further modifications. However, to improve manufacturability, we introduce a concept called even wire distribution, a key element of the SURF physical design tool. To alleviate congestion, we first move vias and wires towards less dense areas in a manner which preserves the existing wiring paths. Depending on the locally available area, we then increase wire spacing to reduce defect sensitivity, without changing the area of the design. Carafe, an inductive fault analysis tool is used to evaluate the new layout. 1.0 Introduction Design for manufacturability (DFM) is becoming increasingly more important as feature sizes have shrunk to the submicron level and die sizes have increased dramatically for high performance microprocessor designs. Although progress has been made in improving manufacturing process ca...