A three-dimensional binocular range sensor LSI with a 106 dB wide dynamic range pixel
Masatomo Kawano, Yukari Hirata, Yutaka Arima · 2010
We developed a 106 dB wide dynamic range binocular three-dimensional (3D) range sensor LSI. The developed LSI chip was produced using a process of 0.35 μm Complementary Metal Oxide Semiconductor (CMOS) 1-poly 3-metal and has a die size of 4.20 × 3.57 mm2. The chip uses a 3.0 V supply voltage and has a power consumption of 375 mW at a clock frequency of 10 MHz. The sensor has two image sensors and all the correlation circuits integrated on a single chip and its operation is based on stereo vision. We have previously developed a 3D range sensor LSI. However, this sensor uses a typical CMOS image sensor and was unable to simultaneously detect objects with an extreme brightness difference. Thus, the use of such sensors in an outdoor environment is difficult. The newly developed 3D range sensor LSI uses a pixel circuit with an expandable dynamic range. As a result, it became possible to simultaneously detect the 3D position of objects outdoors with different light conditions.