Maximizing throughput of temperature-constrained multi-core systems with 3D-stacked cache memory
Kyungsu Kang, Jongpil Jung, Sungjoo Yoo, Chong‐Min Kyung · 2011
Three-dimensional integration has the potential to increase integration density and to reduce communication latency of chip-multiprocessors (CMPs). However, high power density (i.e., power dissipation per unit volume) due to the high integration incurs temperature-related problems in reliability, power consumption, performance, and system cooling cost. In this paper, we propose a design-time solution for temperature-constrained multi-core systems with 3D stacked cache memory in order to maximize the instruction throughput. The proposed method combines power gating of memory banks in the 3D stacked cache memory, which adapts cache partitioning, and dynamic voltage and frequency scaling (DVFS) of each core in a temperature-aware manner. Experimental results show that the proposed method offers up to 32% (average 15%) performance improvement in terms of instructions per second (IPS) compared with an existing method which only performs cache partitioning without temperature consideration.