Test structures on MCM active substrate: is it worthwhile?
Joan Oliver, Hans G. Kerkhoff · University of Twente Research Information · 1996
The miniaturization of electronic systems in areas such as electronic integration and electronic packaging allows the inclusion of devices on reduced substrates constituting a MultiChip Module (MCM). However, with the miniaturization of microsystems big troubles appear in the testing of the MCM. In order to solve the MCM test problem, this paper analyses the cost of using test structures on MCM-Deposited active substrates. Cost results are obtained from yield calculations of test structures placed on active substrate.