Estimating the Manufacturing Yield of Compiler-Based Embedded SRAMs
X. Wang, Marco Luigi Ottavi, F.J. Meyer, Fabrizio Lombardi · IEEE Transactions on Semiconductor Manufacturing · 2005
This paper provides a detailed analysis of the yield of embedded static random access memories (eSRAM) generated using a compiler. Defect and fault analysis inclusive of industrial data are presented for these chips by taking into account the design and the physical properties of the layout. A new tool called compiler-based Array Yield Analysis (CAYA) is introduced. CAYA allows for a characterization of the design process which accounts for fault types and the relation between functional and structural faults; moreover, it also relies on a novel empirical model which facilitates yield calculation. Industrial data is provided for the analysis of various configurations with different structures and redundancy. Architectural considerations, such as array size and line (word and bit) organization are analyzed. Compiler-based features of different kernels (such as required for decoding) are also treated in detail. An extensive evaluation of the provided redundancy (row, column, and combined) is pursued to characterize its impact on the memory yield. Industrial data is used in the evaluation and an industrial ASIC chip (made of multiple eSRAMs) is also considered as design case.