A QoS-Enabled On-Die Interconnect Fabric for Kilo-Node Chips
Boris Grot, Joel Hestness, Stephen W. Keckler, Onur Mutlu · IEEE Micro · 2012
To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren't designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.