Thermal characterization of high speed DDR devices in system environments [DRAM modules]
Joonghyun Baek, Byungse So, Taekoo Lee, Yunhyeok Im, Seyong Oh · 2003
This paper studies the thermal characteristics of various memory modules for desktop and server systems. Using a CFD (computational fluid dynamics) simulator, we simulated these modules to predict their junction temperature. A detailed simulation model and power calculation procedures are described. Simulation results are provided for different conditions and parameter variations. Also, thermal measurements of these modules were carried out in real systems. The simulation and measured data were compared, and the results proved that the simulation model was sufficiently accurate for use in memory subsystem thermal design. Using the proposed simulation model of these modules and analysis results, the minimum requirements were defined for avoiding thermal problems in newly designed memory modules.