High performance MCM-L package for digital processing applications
J. Mosko · 2002
Multichip modules continue to be of interest in applications where speed and thermal performance need to be maximized while weight and size are minimized. One solution to such design criteria is discussed here and its application in a digital CPU, cache control, and memory package is demonstrated. The integration of the various chips into a single interconnect package from each individual package enhances performance. This design characteristics used allowed the development of a processor/memory controller/RAM multichip package capable of routing >2000 nets in less than 22 cm/sup 2/ providing a junction to case thermal performance of 0.1/spl deg/C/watt for the CPU.