Low cost multi chip modules
M. Dobers, M. Seyffert, F.-D. Hauschild, C.-P. Czaya · 2002
The use of multi chip modules (MCMs) has, up to now, been restricted to high tech, high cost and low volume electronics such as military and aerospace applications. There is, however, no cause for this restriction: even in relatively simple electronics like car radios, MCMs can result in significantly reduced costs and improved performances. We have developed a new type of MCM: laminate-based multi chip modules, the interface of which to the next higher system level is a ball grid array. The modules contain both integrated circuits and passive components like chip capacitors and resistors. The protection of the ICs is achieved by a plastic cap which is glued to the substrate. We consider conceptional questions, the construction of the modules, and the actual status of qualification.>