A multi-chip module substrate testing algorithm
S.-Z. Yao, Nan-Chi Chou, Chung‐Kuan Cheng, T. C. Hu · 2002
Discusses substrate short/open fault detection in MCM manufacturing, and propose a complete open fault coverage algorithm which generates a minimum number of tests required to completely cover all open faults. The algorithm generates only about half of the test size compared to that of ordinary approaches. Multi-dimensional TSP algorithms are devised to optimize probe routes with quite encouraging results.>