A Chip-Stacked Memory for On-Chip SRAM-Rich SoCs and Processors
Hideaki Saito, Masayuki Nakajima, Takumi Okamoto, Yusuke Yamada, Akira Ohuchi, Noriyuki Iguchi, Toshitsugu Sakamoto, Koichi Yamaguchi, Masayuki Mizuno · IEEE Journal of Solid-State Circuits · 2010
A dynamic-reconfigurable memory chip is fabricated, by which on-chip memories of an SoC chip can be moved to the memory chip to increase the efficiency of memory usage, and stacked on a logic chip by using three dimensional packaging technology. In the memory chip, many RAM-macros are arrayed and they are connected through two dimensional mesh network interconnects. By using memory-specified network interconnects, area overhead of network interconnects for the memory chip is reduced by 63% and the latency overhead by 43%. Signal lines between the two chips are directly connected by 10-¿m-pitch inter-chip electrodes, resulting in fast and low-energy inter-chip transmission.