Structured test methodologies and test economics for multichip modules
Kevin Kornegay, Kaushik Roy · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996
Multichip modules (MCMs) use complex digital, analog, and mixed-signal chips on a single substrate from different vendors. To ensure quality of die and the functionality and performance of MCMs, extensive testing is required at all levels. This paper presents structured test methodologies for MCMs. The economics associated with these methodologies and their relative cost at the MCM level are also presented.