Thermal Stress Simulation Of Electronic Device By Boundary Element Method
K. Yasutake, Yuta Shinki, Yuichi Ohtani · International Electronics Manufacturing Technology Symposium · 1997
A three-dimensional heat conduction and thermal stress simulation system for an electronic device using BEM (Boundary Element Method) is developed. A mechanical designer of the electronic device package who is not specialist for the numerical analysis is easily carried out the heat conduction and the thermal stress simulation by using this system. The simulation system is characterized by auto mesh generation for BEM and high accuracy of numerical solution. Therefore it is more easy to use for the designer than the other FEM (Finite Element Method) system. Some examples of the numerical analysis of the electronic device packages are shown in this paper. These results prove practicability and advantage of the present system against experiment and FEM system.