QC-Fill: Quick-and-Cool X-Filling for Multicasting-Based Scan Test
Chao-Wen Tzeng, Shi‐Yu Huang · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2009
This paper presents anX-fillscheme that properly utilizes the don't-care bits in test patterns to simultaneously reduce the test time as well as the test power (including both capture power and shifting power). This scheme, called Quick-and-Cool X-fill (QC-Fill), built upon the multicasting-based scan architecture, further leverages on the merits of previous low-capture-power X-fill methods through techniques likemulticasting-driven X-fillandclique stripping.QC-Fillis independent of the automatic test pattern generation patterns and does not require any extra area overhead. Experimental results demonstrate that this scheme strikes a good balance between the seemingly conflicting criteria of low power and test compression.