Design and Implementations of RF Systems and Sub-systems in LCP-type Multilayer Technology
Sidharth Dalmia, Vinu Govind, Jeff Dekosky, V. Sundaram, G. Edward White, Madhavan Swaminathan · 2006
Miniaturization and data throughput are key driving factors in the growth and deployment of wireless LAN (WLAN) networks. This paper presents a novel LCP-based organic packaging technology for implementation of RF systems and sub-systems. Examples shown include low-profile baluns, bandpass filters and front-end modules (FEM) for 802.11a/b/g and 802.11n applications