Using a Distributed Rectangle Bin-Packing Approach for Core-based SoC Test Scheduling with Power Constraints
Yu Xia, Malgorzata Chrzanowska-Jeske, Benyi Wang, Marcin Jeske · 2003
We present a new algorithm to co-optimize test scheduling and wrapper design under power constraints for core-based SoCs (System on Chip). Core testing solutions are generated as a set of wrapper designs, each represented by a rectangle with width equal to the test time and height equal to the number of TAM (Test Access Mechanism) wires used. The test-scheduling problem with power constraints is formulated as the distributed rectangle binpacking problem, which allows wrapper pins to be assigned to nonconsecutive SoC pins. The generalized problem for multiple-TAMs is solved by global optimization using evolutionary strategy and the sequence-pair representation. Experiments on ITC’02 benchmarks are very encouraging. 1.