An interactive VLSI CAD tool for yield estimation
Israel A. Wagner, Israel Koren · IEEE Transactions on Semiconductor Manufacturing · 1995
The yield of a VLSI chip depends on the sensitivity of the chip to defects occurring during the fabrication process, among other factors. To predict this sensitivity, one usually needs to compute the so-called critical area (A/sub c/), which reflects how many and how large the defects must be in order to result in a circuit failure. The main computational problem in yield estimation is to calculate A/sub c/ efficiently for complicated, irregular layouts. A novel approach is suggested for this problem that results in an algorithm that will solve it efficiently. This paper provides an interactive, accurate, and fast method for the evaluation of critical area as a design tool; the tool utilizes good visual feedback to allow layout improvement for higher yield. The algorithm is compared to other yield-prediction methods, which use either the Monte Carlo approach (VLASIC) or a deterministic approach (SCA); the algorithm is shown to be faster. It also has the advantage that it can graphically show a detailed 'defect sensitivity map' that can assist a chip designer in improving the yield of his/her layout.>