Test Optimization for Core-based System-on-Chip
Anders G. Larsson · 2008
THE SEMICONDUCTOR TECHNOLOGY has enabled the fabrication of integrated circuits (ICs), which may include billions of transistors and can contain all necessary electronic circuitry for a complete system, so-called System-on-Chip (SOC). In order to handle design complexity and to meet short time-to-market requirements, it is increasingly common to make use of a modular design approach where an SOC is composed of pre-designed and pre-verified blocks of logic, called cores. Due to imperfections in the fabrication process, each IC must be individually tested. A major problem is that the cost of test is increasing and is becoming a dominating part of the overall manufacturing cost. The cost of test is strongly related to the increasing test-data volumes, which lead to longer test application times and larger tester memory requirement. For ICs designed in a modular fashion, the high test cost can be addressed by adequate test planning, which includes test-architecture design, test scheduling, test-data compression, and test sharing techniques.