Memory Efficient Modular VLSI Architecture for Highthroughput and Low-Latency Implementation of Multilevel Lifting 2-D DWT

Basant Kumar Mohanty, Pramod Kumar Meher · IEEE Transactions on Signal Processing · 2011

In this paper, we present a modular and pipeline architecture for lifting-based multilevel 2-D DWT, without using line-buffer and frame-buffer. Overall area-delay product is reduced in the proposed design by appropriate partitioning and scheduling of the computation of individual decomposition-levels. The processing for different levels is performed by a cascaded pipeline structure to maximize the hardware utilization efficiency (HUE). Moreover, the proposed structure is scalable for high-throughput and area-constrained implementation. We have removed all the redundancies resulting from decimated wavelet filtering to maximize the HUE. The proposed design involvesLpyramid algorithm (PA) units and one recursive pyramid algorithm (RPA) unit, whereR=N/P,L=⌈log4P̅⌉ andPis the input block size,MandN, respectively, being the height and width of the image. The entire multilevel DWT is computed by the proposed structure inMRcycles. The proposed structure hasO(8R×2L) cycles of output latency, which is very small compared to the latency of the existing structures. Interestingly, the proposed structure does not require any line-buffer or frame-buffer, unlike the existing folded structures which otherwise require a line-buffer of sizeO(N) and frame-buffer of sizeO(M/2×N/2) for multilevel 2-D computation. Instead of those buffers, the proposed structure involves only local registers and RAM of sizeO(N). The saving of line-buffer and frame-buffer achieved by the proposed design is an important advantage, since the image size could very often be as large as 512 × 512. From the simulation results we find that, the proposed scalable structure offers better slice-delay-product (SDP) for higher throughput of implementation since the on-chip memory of this structure remains almost unchanged with input block size. It has 17% less SDP than the best of the corresponding existing structures on average, for different input-block sizes and image sizes. It involves 1.92 times more transistors, but offers 12.2 times higher throughput and consumes 52% less power per output (PPO) compared to the other, on average for different input sizes.

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