Manufacturing defects testing of a multi-chip-module using IEEE 1149.1 boundary scan test and embedded built-in test software

B.J. Round

doi:https://doi.org/10.1109/autest.1993.396355

Manufacturing defects testing of a multi-chip-module using IEEE 1149.1 boundary scan test and embedded built-in test software

B.J. Round · 2002

This paper describes the use of boundary scan based tests and embedded built in test (BIT) software in the manufacturing defects testing of a 100 MHz, high density, surface mount multi-chip-module, parallel processing computer.>

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