Networks-in-Package; Design, Analysis and Implementation
Gawon Kim, Kangmin Lee, Jin-Han Kim, Kicheol Bae, ChoonHeung Lee, Hoi‐Jun Yoo, Joungho Kim · 2006
SiP (system-in-package) and SoC (system-on-chip) are familiar to us. In this paper, we firstly define advanced concepts of NoC (network-on-chip) and NiP (network-in-package). Design and implementation of NoC are explained and then, NiP used for NoC is designed and analyzed regarding of signal integrity and power integrity. The low-power packet-switched NoC with hierarchical star topology is designed and implemented for high-performance SoC platform. An NiP integrating four NoCs is fabricated in a 676-BGA-type package for large and scalable systems and the measured results of the NiP show perfect communications between NoCs