A three-dimensional photoresist etching simulator for TCAD
Ioannis G. Karafyllidis · Modelling and Simulation in Materials Science and Engineering · 1999
Cellular Automata have been extensively used as a two-dimensional simulator of the photoresist etching process. This simulator has been verified experimentally for 248 nm photolithography. In this work the Cellular Automata simulator is extended in three dimensions in order to deal with problems arising in 193 nm photolithography and beyond. The three-dimensional simulator is tested using well known etch-rate distribution functions and its results are compared with experimental results found in the literature.