Thermal test and monitoring [microelectronic structures]
V. Székely, M. Rencz · European Design and Test Conference · 1995
We present possible solutions for the life-time thermal monitoring of microelectronic structures. In order to grab the thermal state of an encapsulated device, insertion of one or more temperature sensors is proposed. A new concept temperature sensor element is introduced: the thermal-feedback oscillator (TFO). The TFO has a digital output signal and therefore is suitable for being integrated with other built-in test circuits, such as boundary-scan. Results of the experimental realization of the TFO temperature sensor are presented. >