A reliability growth model for modular software
Hiroyuki Okamura, Shingo Kuroki, Tadashi Dohi, Shunji Osaki · Electronics and Communications in Japan (Part II Electronics) · 2004
Abstract This paper presents a probabilistic model for evaluating the reliability of software having modular structure. In particular, it proposes a new reliability‐evaluating model based on the structure of software by integrating the Jelinski–Moranda model, which is the most basic black box model, and the Littlewood model, which is a representative white box model. The performance of the proposed model is compared and studied in reference to the benchmark model of Cheung and the dependency of the architecture and the reliability growth in software reliability evaluation is discussed. © 2004 Wiley Periodicals, Inc. Electron Comm Jpn Pt 2, 87(5): 43–53, 2004; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/ecjb.20075