On Chip Temperature Sensors' Layout for Future Thermal Management
Shi Jiao-fang, Jian Wang · 2010
The growing power density and temperature on processor chip caused the issue of chip's reliability. Some techniques of temperature measuring and thermal management have been applied to cope with it. Limitations and insufficiency of existing temperature measuring methods and new thermal management methods are analyzed. And new thermal management methods are listed. To match with future thermal management methods, new temperature measuring points are proposed.