Simulating Open-Via Defects
S. Spinner, Jie Jiang, Ilia Polian, Piet Engelke, Bernd Becker · 2007
Open-via defects are a major systematic failure mechanism in nanoscale manufacturing processes. We present a flow for simulating open-via defects. Electrical parameters are extracted from the layout and technology data and represented in a way which allows efficient simulation on gate level. The simulator takes oscillation caused by open-via defects into account and quantifies its impact on defect coverage. The flow can be employed for manufacturing test as well as for defect diagnosis.