Thermal-aware Dynamic Buffer Allocation for Proactive routing algorithm on 3D Network-on-Chip systems
Yuan-Sheng Lee, Hsien-Kai Hsin, Kun-Chih Jimmy Chen, En-Jui Chang, An-Yeu Andy Wu · 2014
The thermal problems of three-dimensional Network-on-Chip (3D NoC) systems become more serious because of die stacking and different thermal conductance between layers. Up to now, most previous works cannot further achieve thermal balance of the 3D NoC systems since they consider either only temperature or only traffic information. We propose a Proactive Thermal-Dynamic-Buffer Allocation (PTDBA) scheme to constrain the routing resource around overheated regions. In addition, we reduce the frequency of packets switching in overheated router regions. By doing so, we can slow down the rate of temperature increment. Based on the proposed PTDBA, we can redistribute traffic load by means of buffer occupancy. The experimental results show that the proposed scheme can reduce the deviation of temperature distribution by 25.6% and help to improve network throughput in non-stationary irregular mesh by 74.8% compared with PTB3R.