Layer minimization of escape routing in area array packaging
Renshen Wang, Rui Feng Shi, Chung‐Kuan Cheng · Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design · 2006
We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach.