Research Challenges on 2-D and 3-D Network-on-Chips
Hiroki Matsutani · 2013
The advances in semiconductor technology allow us to integrate a number of processing cores on a single chip or a single package. These many-core processors are expected to boost a wide range of applications from high-performance computing, cyber-physical computing, cloud, and big data processing. This tutorial first introduces recent many-core processors and then focuses on fundamental technologies of 2-D and 3-D Network-on-Chip architectures in terms of network topology, routing algorithm, and router architecture. Recent research challenges on 2-D and 3-D Network-on-Chip architectures, such as 2-D and 3-D wireless technologies, are also surveyed.