Wideband Probing Techniques For Planar Devices: A Review
E.W. Strid · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1988
A review of high-frequency wafer-probing techniques which use contact to the device under test is given. 50-ohm probes have recently been developed for frequencies up to 50 GHz. On-wafer impedance standards and calibration accuracies have also improved. Probes for high-speed MSI circuits require low-impedance power-supply connections. Probes for non-intrusive measurement of internal IC nodes are also reviewed.