Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling
Ayse Kivilcim Coskun, David Atienza, Mohamed M. Sabry, Jie Meng · IEEE Micro · 2011
This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.