A modular test structure for CMOS mismatch characterization
Massimo Conti, Paolo Crippa, F. Fedecostante, Simone Orcioni, Francesco Ricciardi, Claudio Turchetti, Loris Vendrame · 2003
In this work a new test structure for mismatch characterization of CMOS technologies is presented. The test structure is modular, with a reduced area and it can be inserted in the space between the dies (scribe lines) on the wafers. The test structure has been implemented in a standard 0.18-/spl mu/m digital CMOS technology.